Equipment description:

SN: 4196

Vintage: 1992

● Purpose: KLA-Tencor FLX-2320 is a manual load thin film stress measurement instrument. It accurately measures the changes in the radius of curvature of the substrate caused by the deposition of a stressed thin film on the substrate.

● Model: KLA-Tencor FLX-2320

   1. Manual load type to support 75 mm, 100 mm, 125 mm, 150 mm, and 200 mm Wafer Size

● PC configurations: OS: Windows 3.1

● Application software: WINFLX Application Version 4.27

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