1 Equipment description:

1.1 Purpose: Unpatterned Surface Inspection System, to monitor: Bare silicon wafers and bare silicon wafers with films surface particles and defects.

1.2 Model: KLA-Tencor SP1-TBI

1.3 Original Manufacture Date: February, 2006

1.4 SN: 0206-1060

1.5 Location: Currently in Omni-Semitech Inc. cleanroom

2 System configuration:

2.1 Currently Configured for 200mm Wafer Size

2.2 Handler: 200mm~300mm Open cassette (x1) stations (depend customer option)

2.3 Cassette Handling: Vacuum Handling Open Handler (depend customer option)

2.4 Robot: Equip 32, Single / Dual End-Effector (depend customer option)

2.5 Chuck Type: 200/300mm Vacuum

2.6 Laser: 30mW Argon Laser

2.7 Operator Interface: Trackball and keyboard standard

1 Equipment description:

1.1 Purpose: Unpatterned Surface Inspection System, to monitor: Bare silicon wafers and bare silicon wafers with films surface particles and defects.

1.2 Model: KLA-Tencor SP1-TBI

1.3 Original Manufacture Date: February, 2006

1.4 SN: 0206-1060

1.5 Location: Currently in Omni-Semitech Inc. cleanroom

2 System configuration:

2.1 Currently Configured for 200mm Wafer Size

2.2 Handler: 200mm~300mm Open cassette (x1) stations (depend customer option)

2.3 Cassette Handling: Vacuum Handling Open Handler (depend customer option)

2.4 Robot: Equip 32, Single / Dual End-Effector (depend customer option)

2.5 Chuck Type: 200/300mm Vacuum

2.6 Laser: 30mW Argon Laser

2.7 Operator Interface: Trackball and keyboard standard