Equipment description:

‧Purpose: Thin Film Measurement Systems

‧Model: FX100

‧Original Manufacture Date: TBD

‧SN: TBD

System configuration:

‧Currently Configured for 300mm Wafer Size

‧Handler: H5-FA Wafer handler, 300mm wafer Load port.

‧Cassette Handling: FOUP

‧Robot: H5 Brooks Wafer handler, Single End-Effector

‧Chuck Type: 200/300 mm

‧Operator Interface: Trackball and keyboard standard

‧Measurement System: DBS/SE/SEEC/STRESS

‧PC configurations:

1. CPU: PIII 850MHz
2. Memory: 512M
3. OS: Windows NT4.0 environment

‧Application software: SUMMIT V4.6

‧GEM/SECS: SECSII/GEM

‧Facilities:

Vacuum: 20” (510 mm) Hg @ 1 SCFM

Air: Minimum 90-100 psi

Power: 200/208/220/230/240VAC (± 5%) @15 Amps, single phase, 50/60 Hz. The power demand is 3 KVA maximum, 1.7 KVA continuous.

N/A